NEW YORK , Nov. 12, 2024 /PRNewswire/ -- Report on how AI is driving market transformation - The global thermal interface materials market size is estimated to grow by USD 3.16 billion from 2024-2028, according to Technavio.
The market is estimated to grow at a CAGR of over 18.57% during the forecast period. Increasing demand from computers hardware manufacturing is driving market growth, with a trend towards advances in technology.
However, miniaturization of electronic devices poses a challenge.Key market players include 3M Co., AIM Metals and Alloys LP, AOS Thermal Compounds LLC, Bergquist, DALEBA ELECTRONICS LTD, Dow Chemical Co.
, DuPont de Nemours Inc., Fuji Polymer Industries Co. Ltd.
, GrafTech International Ltd., Henkel AG and Co. KGaA, Honeywell International Inc.
, Indium Corp., KITAGAWA INDUSTRIES America Inc., Laird Performance Materials, Momentive Performance Materials Inc.
, Parker Hannifin Corp., SEMIKRON Elektronik GmbH and Co. KG, Shin Etsu Chemical Co.
Ltd., Wakefield Thermal Inc., and ZALMAN.
AI-Powered Market Evolution Insights. Our comprehensive market report ready with the latest trends, growth opportunities, and strategic analysis- View Free Sample Report PDF Forecast period 2024-2028 Base Year 2023 Historic Data 2018 - 2022 Segment Covered Application (Computers, Telecom, Automotive electronics, Medical devices, and Others), Type (Grease and adhesive, Taps and films, Phase change materials, and Others), and Geography (APAC, North America, Europe, South Am.
